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NTB25P06, NVB25P06
Power MOSFET
? 60 V, ? 27.5 A, P ? Channel D 2 PAK
Designed for low voltage, high speed switching applications and to
withstand high energy in the avalanche and commutation modes.
Features
? AEC Q101 Qualified ? NVB25P06
? These Devices are Pb ? Free and are RoHS Compliant
Typical Applications
? PWM Motor Controls
? Power Supplies
? Converters
? Bridge Circuits
V (BR)DSS
? 60 V
http://onsemi.com
R DS(on) TYP
65 m W @ ? 10 V
P ? Channel
D
I D MAX
? 27.5 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating Symbol
Value
Unit
G
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
? Continuous
? Non ? Repetitive (t p v 10 ms)
V DSS
V GS
V GSM
? 60
" 15
" 20
V
V
Vpk
S
MARKING DIAGRAM
& PIN ASSIGNMENT
Drain Current
? Continuous @ T A = 25 ° C
? Single Pulse (t p v 10 m s)
I D
I DM
27.5
80
A
Apk
Drain
Total Power Dissipation @ T A = 25 ° C
Operating and Storage
Temperature Range
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 25 V, V GS = 10 V,
I L(pk) = 20 A, L = 3 mH, R G = 25 W )
P D
T J , T stg
E AS
120
? 55 to
+175
600
W
° C
mJ
1
2
3
D 2 PAK
CASE 418B
4
Gate
NTB
25P06G
AYWW
Drain
Source
Thermal Resistance
? Junction ? to ? Case
? Junction ? to ? Ambient (Note 1)
? Junction ? to ? Ambient (Note 2)
R q JC
R q JA
R q JA
1.25
46.8
63.2
° C/W
A
Y
WW
G
= Assembly Location
= Year
= Work Week
= Pb ? Free Package
Maximum Lead Temperature for Soldering
Purposes, (1/8 ″ from case for 10 s)
T L
260
° C
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1 ″ pad size
(Cu Area 1.127 in 2 ).
2. When surface mounted to an FR4 board using the minimum recommended
pad size (Cu Area 0.412 in 2 ).
Device
NTB25P06T4G
NVB25P06T4G
Package
D 2 PAK
(Pb ? Free)
D 2 PAK
(Pb ? Free)
Shipping ?
800 / Tape & Reel
800 / Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 4
1
Publication Order Number:
NTB25P06/D
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